Autom8 Script Library


This Library is composed of scripts that perform a wide variety of functions, each offering the system user an opportunity to not only improve working efficiency but also add a consistency that only automation can provide. All scripts are geared to the Genesis 2000 CAM environment and will rely on the presence of certain basic system modules. For price list and detailed specification contact sales@autom8.net

Description

Library Name

Removal of shapelists from step layers (reduction of memory usage)

del_shplst

Auto-creation of flipped step (for placement in a flip-flop style assembly panel)

flipflop_step

Positive Power/Ground layer optimisation routine (not the internal Genesis positive plane optimise function).

pospln_opt

Creates a plot step with each plot layer as a laid-up optimised film (requires Genesis film optimise license)

opt_plots

Creates a plot step with each plot layer as a laid-up optimised film (not requiring Genesis film optimise license)

a8_opt_plots

Prints a selected window directly to a printer (Sun systems only).

print_win

Creates a drill test coupon (first / last style).

create_tc

Creates a component (block) reference layer (auto-detection of BGA, IC, QFP with minimal interaction for other types)

comp_detect

Changes round, rectangle and square pads on rout layers to be pocket mill chains.

pckt_mill

Creates and prints (postscript) layers with text boxes added (useful for check plots and drill drawings etc.)

prt_chk_plt

Creates a flip-flop assembly panel.

ffpanel

Graphic compare of pcb step to the backup step (ignores Genesis pin hole and sliver fixes). Included in Planlink.

auto_grp_cmp

Runs a netlist compare between the pcb step and the backup step. Included in Planlink.

auto_net_cmp

Adds two smaller drill holes inside a large drill hole to help break down the swarf.

pigsnout

Adds a box outline to all affected layers (dependant on user input).

add_box

Loads 274x files, creates a new job, input to output with rpd files sent directly to barco/gerber crescent plotter queue.

gbx-rpd.cnv

Adds resist clearances to all plated holes. Clearance is 6mil smaller than hole, duplicate/covered pads are removed.

add_res_clr

Breaks i274x macro apertures on solder mask and circuit layers, converting to standard symbols.

brk_i274

A covered pad removal function on the outer circuit layers but leaves any covered smd pads unaffected.

cov_smd_rem

Detects where non-plated features touch copper on circuit layers in pcb and assembly panel steps.

find_npt

Fixes spacing between pads where spacing is below a defined value (Netlist validation)

p2p_fix

Standalone sub panel optimisation routine.

sub_pan

Fixes spacing for pad2pad, pad2surface and surface2surface when spacing is below defined value (Netlist validation).

space_fix

Via hole size/pad size optimise routine considering smallest via hole and available minimum copper spacing

viaph_opt

Creates an output report showing the customer supplied file name and the genesis layer name that it was given.

inp_rename_rep

Auto-detect Via plugging requirement (using open, partial or closed via resist windows)

via_res_typside

Parameters based sub panel creation program including rotation of lines of steps (includes rotation but not flipflop).

subpan_create

Automatically merges layers together using a simple naming convention and then allows the user to check the matrix.

merge_lays

Auto Structure routine - collates all board, polarity, layer and drill attributes for knowledge based HDI panelisation.

create_struc

Creation of a daisy chain test coupon for void testing of all blind / buried via layers (works with above script)

add_dchain

Creation of a micro-section test coupon, built to simulate track, gap, annular ring and board drilling sequence

micro_coup

Creation of two separate military specification coupons using board design information.

create_milcoup

Detects and reports if circuit layer pads are too close to gold fingers.

pads2gold

Detects and reports if gold fingers occur and on which circuit edge.

rep_gold

Checks (and reports) on inner layer features too close to a chamfered edge (positive and negative layers supported).

chamf_chk

Detects and reports the smallest via holes and plated holes found within a step.

min_hle_rep

Check peelable mask to copper coverage/clearance, and to non-plated hole spacing. Checking sizes of covered holes.

peel2cu

Detects any gold plated fingers and automatically adds tie bars to the step.

add_tab_tie

Detects presence of CAD Netlist, runs a CBC to current netlist check with user warnings if the check has errors.

auto_cadn_cmp

Detects and sets attributes for BGA footprints, full BGA report on qty, min pad, min track and gap and BGA area.

auto_bga_chk

Detects and sets attributes (non electric) for gold tie bars that extend beyond the circuit area.

detect_tab_tie

Setting of impedance layers, attributes and models (stripline, broadside and differential) inc. ohms, track and gap details

imp_data_set

Runs a pad cleanup cycle using solder mask selection to cleanup drawn pads typically missed by standard routines.

pad_clean_spl

Replaces overlapping square or rectangle pads that form a graphical pad, creating single pads.

fix_double_sq

Location of square and rectangle pads replacing square with rounded corners.

round_corner

Detection of possible missing thermal pads (potential result of an input error).

chk_thrm_inp

Creates a score (vcut) drawing including adding dimension lines and measurement text.

score_drg

Creates output for the dp100 LDI system (supports single layers or layer pairs).

out_dp100

Creates a drill symbol plot layer using letters for plated holes and numbers for non-plated holes (includes a drill table).

panel_drldrg

Creates a print (postscript) of "critical lines" (i.e. impedance lines) including text boxes on each layer.

prt_imp_plt

Works on silkscreen layers to find and remove any element smaller than 8 mils in both X and Y axis.

rem_ss_sml

Check that each flashed pad on solder mask layers have corresponding flashed pads on the circuit layers

sm2cu_padchk

Removes any non-plated pad on signal layers which has less than 6 mils annular ring.

rem_smlnpthar

Uses a simple naming convention to automatically set start and end layer of the drills (e.g. blind / buried drill layers).

set_stend_drl