Autom8 Script Library
This Library is composed of scripts that perform a wide variety of functions, each offering the system user an opportunity to not only improve working efficiency but also add a consistency that only automation can provide. All scripts are geared to the Genesis 2000 CAM environment and will rely on the presence of certain basic system modules.
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Description |
Library Name |
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Removal of shapelists from step layers (reduction of memory usage) |
del_shplst |
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Auto-creation of flipped step (for placement in a flip-flop style assembly panel) |
flipflop_step |
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Positive Power/Ground layer optimisation routine (not the internal Genesis positive plane optimise function). |
pospln_opt |
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Creates a plot step with each plot layer as a laid-up optimised film (requires Genesis film optimise license) |
opt_plots |
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Creates a plot step with each plot layer as a laid-up optimised film (not requiring Genesis film optimise license) |
a8_opt_plots |
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Prints a selected window directly to a printer (Sun systems only). |
print_win |
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Creates a drill test coupon (first / last style). |
create_tc |
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Creates a component (block) reference layer (auto-detection of BGA, IC, QFP with minimal interaction for other types) |
comp_detect |
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Changes round, rectangle and square pads on rout layers to be pocket mill chains. |
pckt_mill |
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Creates and prints (postscript) layers with text boxes added (useful for check plots and drill drawings etc.) |
prt_chk_plt |
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Creates a flip-flop assembly panel. |
ffpanel |
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Graphic compare of pcb step to the backup step (ignores Genesis pin hole and sliver fixes). Included in Planlink. |
auto_grp_cmp |
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Runs a netlist compare between the pcb step and the backup step. Included in Planlink. |
auto_net_cmp |
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Adds two smaller drill holes inside a large drill hole to help break down the swarf. |
pigsnout |
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Adds a box outline to all affected layers (dependant on user input). |
add_box |
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Loads 274x files, creates a new job, input to output with rpd files sent directly to barco/gerber crescent plotter queue. |
gbx-rpd.cnv |
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Adds resist clearances to all plated holes. Clearance is 6mil smaller than hole, duplicate/covered pads are removed. |
add_res_clr |
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Breaks i274x macro apertures on solder mask and circuit layers, converting to standard symbols. |
brk_i274 |
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A covered pad removal function on the outer circuit layers but leaves any covered smd pads unaffected. |
cov_smd_rem |
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Detects where non-plated features touch copper on circuit layers in pcb and assembly panel steps. |
find_npt |
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Fixes spacing between pads where spacing is below a defined value (Netlist validation) |
p2p_fix |
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Standalone sub panel optimisation routine. |
sub_pan |
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Fixes spacing for pad2pad, pad2surface and surface2surface when spacing is below defined value (Netlist validation). |
space_fix |
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Via hole size/pad size optimise routine considering smallest via hole and available minimum copper spacing |
viaph_opt |
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Creates an output report showing the customer supplied file name and the genesis layer name that it was given. |
inp_rename_rep |
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Auto-detect Via plugging requirement (using open, partial or closed via resist windows) |
via_res_typside |
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Parameters based sub panel creation program including rotation of lines of steps (includes rotation but not flipflop). |
subpan_create |
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Automatically merges layers together using a simple naming convention and then allows the user to check the matrix. |
merge_lays |
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Auto Structure routine - collates all board, polarity, layer and drill attributes for knowledge based HDI panelisation. |
create_struc |
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Creation of a daisy chain test coupon for void testing of all blind / buried via layers (works with above script) |
add_dchain |
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Creation of a micro-section test coupon, built to simulate track, gap, annular ring and board drilling sequence |
micro_coup |
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Creation of two separate military specification coupons using board design information. |
create_milcoup |
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Detects and reports if circuit layer pads are too close to gold fingers. |
pads2gold |
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Detects and reports if gold fingers occur and on which circuit edge. |
rep_gold |
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Checks (and reports) on inner layer features too close to a chamfered edge (positive and negative layers supported). |
chamf_chk |
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Detects and reports the smallest via holes and plated holes found within a step. |
min_hle_rep |
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Check peelable mask to copper coverage/clearance, and to non-plated hole spacing. Checking sizes of covered holes. |
peel2cu |
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Detects any gold plated fingers and automatically adds tie bars to the step. |
add_tab_tie |
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Detects presence of CAD Netlist, runs a CBC to current netlist check with user warnings if the check has errors. |
auto_cadn_cmp |
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Detects and sets attributes for BGA footprints, full BGA report on qty, min pad, min track and gap and BGA area. |
auto_bga_chk |
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Detects and sets attributes (non electric) for gold tie bars that extend beyond the circuit area. |
detect_tab_tie |
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Setting of impedance layers, attributes and models (stripline, broadside and differential) inc. ohms, track and gap details |
imp_data_set |
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Runs a pad cleanup cycle using solder mask selection to cleanup drawn pads typically missed by standard routines. |
pad_clean_spl |
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Replaces overlapping square or rectangle pads that form a graphical pad, creating single pads. |
fix_double_sq |
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Location of square and rectangle pads replacing square with rounded corners. |
round_corner |
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Detection of possible missing thermal pads (potential result of an input error). |
chk_thrm_inp |
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Creates a score (vcut) drawing including adding dimension lines and measurement text. |
score_drg |
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Creates output for the dp100 LDI system (supports single layers or layer pairs). |
out_dp100 |
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Creates a drill symbol plot layer using letters for plated holes and numbers for non-plated holes (includes a drill table). |
panel_drldrg |
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Creates a print (postscript) of "critical lines" (i.e. impedance lines) including text boxes on each layer. |
prt_imp_plt |
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Works on silkscreen layers to find and remove any element smaller than 8 mils in both X and Y axis. |
rem_ss_sml |
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Check that each flashed pad on solder mask layers have corresponding flashed pads on the circuit layers |
sm2cu_padchk |
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Removes any non-plated pad on signal layers which has less than 6 mils annular ring. |
rem_smlnpthar |
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Uses a simple naming convention to automatically set start and end layer of the drills (e.g. blind / buried drill layers). |
set_stend_drl |